MICRON Technology broke ground on its high-bandwidth memory (HBM) advanced packaging facility on Wednesday (Jan 8) in Singapore, adjacent to its existing facilities in Woodlands.
The company will invest US$7 billion in the facility “through the end of the decade and beyond”, creating around 1,400 jobs. As part of future site expansions, 1,600 more jobs may be brought about.
The Business Times has reached out to the Economic Development Board to understand how the facility fits into its broader goals for attracting investments into Singapore.
HBM is a form of semiconductor chip that is used in artificial intelligence (AI) training and inference.
Micron said that the new facility will be the first of its kind in Singapore, and will package its latest HBM3E products. Operations are slated to begin in 2026, while “meaningful expansion” of the company’s total advanced packaging capacity will begin in 2027 to meet demand from AI growth.
At the ground-breaking event, Micron president and chief executive officer Sanjay Mehrotra said that the HBM market is expected to “grow dramatically” from roughly US$4 billion in 2023 to more than US$100 billion by 2030.
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He added that the company’s HBM revenue exceeded expectations, doubling in its recent fiscal quarter.
“Our Singapore expansion will also support long-term NAND manufacturing, allowing us to remain nimble and adapt to market needs,” he said. NAND is a form of semiconductor logic gate used in the creation of non-volatile flash memory, such as solid state drives for storage, which Micron also produces.
Micron corporate vice-president and Singapore country manager Chen Kok Sing noted that since 1998, the company has grown its investments in Singapore to more than US$30 billion. These investments include the establishment of greenfield wafer fabrication sites and the expansion to four wafer fabrication facilities.
He noted that the company’s workforce of more than 9,000 has shifted from pure manufacturing activities to engagement in early-phase research and development.
“Our assembly and test facility at Bendemeer Road, one of Singapore’s longest-running semiconductor facilities for more than half a century, has stayed ahead of the curve as an advanced packaging and test facility for complex, high-value products,” he said.
